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| HOME > »ç¾÷ºÐ¾ß > CHEMICAL PLANT |
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| NO. |
ITEM |
INFLUENT |
EFFLUENT |
REMARK |
| 1 |
Process Name |
Liquefied HCI Gas |
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| 2 |
Density |
4%~7% |
28%~30% |
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| 3 |
Temperature |
180¡ÉÀÌÇÏ |
50¡ÉÀÌÇÏ |
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| NO. |
ITEM |
INFLUENT |
EFFLUENT |
REMARK |
| 1 |
Process Name |
Concentrate HCI Gas |
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| 2 |
Density |
4%~7% |
34%~36% |
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| 3 |
Temperature |
180¡ÉÀÌÇÏ |
40¡ÉÀÌÇÏ |
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| NO. |
ITEM |
SPEC/SIZE |
REMARK |
| 1 |
Process Name |
Epoxy Resin |
Liquid Base |
| 2 |
Capacity |
30~ 300ton/day |
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| 3 |
Vent |
Solvent & Dust |
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| FLUID |
ITEM |
MATERIAL |
| HCI, H2SO4, HF, ±âŸ µîµî |
HEAT EXCHANGE |
GLASS TUBE, GRAPHITE |
| STRIPPER, CONDENSER, EVAPORATE |
GRAPHITE, PVDF |
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| NO. |
ITEM |
INFLUENT |
EFFLUENT |
REMARK |
| 1 |
Gas Fluid |
HCl Gas (4~6%) |
HCl Gas(4~6%)
Liquid Concentration (0~26%) |
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| 2 |
Temperature |
180¡É |
53¡É |
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| 3 |
Solid Density |
228PPM |
11.6PPM |
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