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        | HOME > »ç¾÷ºÐ¾ß > CHEMICAL PLANT  | 
     
 
	
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					| NO. | 
					ITEM | 
					INFLUENT | 
					EFFLUENT | 
					REMARK | 
				 
				
					| 1 | 
					Process Name | 
					Liquefied HCI Gas | 
					  | 
				 
				
					| 2 | 
					Density | 
					4%~7% | 
					28%~30% | 
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					| 3 | 
					Temperature | 
					180¡ÉÀÌÇÏ | 
					50¡ÉÀÌÇÏ | 
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					| NO. | 
					ITEM | 
					INFLUENT | 
					EFFLUENT | 
					REMARK | 
				 
				
					| 1 | 
					Process Name | 
					Concentrate HCI Gas | 
					  | 
				 
				
					| 2 | 
					Density | 
					4%~7% | 
					34%~36% | 
					  | 
				 
				
					| 3 | 
					Temperature | 
					180¡ÉÀÌÇÏ | 
					40¡ÉÀÌÇÏ | 
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					| NO. | 
					ITEM | 
					SPEC/SIZE | 
					REMARK | 
				 
				
					| 1 | 
					Process Name | 
					Epoxy Resin | 
					Liquid Base | 
				 
				
					| 2 | 
					Capacity | 
					30~ 300ton/day | 
					  | 
				 
				
					| 3 | 
					Vent | 
					Solvent & Dust | 
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					| FLUID | 
					ITEM | 
					MATERIAL | 
				 
				
					| HCI, H2SO4, HF, ±âŸ µîµî | 
					HEAT EXCHANGE | 
					GLASS TUBE, GRAPHITE | 
				 
				
					| STRIPPER, CONDENSER, EVAPORATE | 
					GRAPHITE, PVDF | 
				 
			 
		
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				| NO. | 
				ITEM | 
				INFLUENT | 
				EFFLUENT | 
				REMARK | 
			   
			  
				| 1 | 
				Gas Fluid | 
				HCl Gas (4~6%) | 
				HCl Gas(4~6%)  
				  Liquid Concentration (0~26%) | 
				  | 
			   
			  
				| 2 | 
				Temperature | 
				180¡É | 
				53¡É | 
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				| 3 | 
				Solid Density | 
				228PPM | 
				11.6PPM | 
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